Components for LiDAR and 3D Sensing
Compact Ceramic RFID Tags
Components for Fiber-Optic Communication Modules
Ceramic Packages for MEMS Sensors
Ceramic Packages and Optical Filters for Image Sensors
Components for Fiber-Optic Connectors
Surface Mount Ceramic Packages for Electronic Devices
Ceramic Packages for Light Emitting Diodes (LEDs)
LTCC Packages for RF Modules
Ceramic Packages for Automotive Electronics
Ceramic Packages for Power Electronics
Components for Wireless Communication Devices
Ceramic Packages for Large Scale Integration (LSI) Devices
Ceramic Substrates for Probe Cards
Glass Hermetic Feedthroughs
Standard Packages and Lids for Device Evaluation
2023/06/14
"Standard Packages and Lids for Device Evaluation" list is updated.
2023/05/30
"Standard Packages and Lids for Device Evaluation" list is updated.
2023/04/18
"Solder-Seal Metal Lids" is deleted.
2023/04/03
"Standard Packages and Lids for Device Evaluation" list is updated.
2023/03/02
OFC 2023 Expo to Feature Kyocera's Solutions for Next-Generation High-Speed Optics, Including Co-Packaged Optics with Superior Mechanical Reliability