Kyocera's new semiconductive ceramic coating provides static elimination by depositing a semiconductive ceramic coated film on the surface of the base material. If the film thickness is 50 μm or less, it has air permeability, so it is used for wafer vacuum chucking parts with porous ceramics to prevent electrostatic breakdown.
Low variation within the coated surface and stable electric resistance can be achieved.
*Results may vary depending on product specifications and usage conditions.
Size: Please consult (we have experience up to 12 inches in diameter)
Thickness: 500 μm or less
*Depends on the type of ceramic material.
*If the thickness is less than 50 μm, air permeability can be ensured when applied to porous materials.
If the shape is complicated, it may be difficult to apply.
Coating process image of wafer chuck
We have experience applying this technology to wafer transfer pads, wafer chucks for processing, and other components that require static elimination functions.
It can be applied to handling arms.
Wafer transfer pad
| Size: | φ128 x t10 (mm) |
| Base material: | Alumina(A479) +Porous alumina(#100) |
| Film thickness: | 50μm |
Wafer chuck for processing
| Size: | Φ235 × t30 (mm) |
| Base material: | Alumina(A479) +Porous alumina(#100) |
| Film thickness: | 50μm |
Values are based on typical material properties and
may vary according to product configuration and manufacturing process.
