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Digital Showcase : Automotive > Product Overview > Components > Sensor Packages    Japanese

Sensor Packages

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Sensor Packages
Kyocera offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications - including accelerometers and angular rate, pressure, optical and RF sensors.

 Product Outline
Features
· Air-cavity type hermetic package
· Close thermal-expansion matching provides superior mechanical elasticity and less mechanical stress with silicon MEMS chips
· Miniaturized, high-density surface mountable package incorporating multi-layer ceramic technology

Applications
· Accelerometers
· Angular rate sensors (gyro sensors, yaw-rate sensors)
· Pressure sensors
· CMOS/CCD Image sensors

 Products and Applications
Packages for MEMS (Micro Electro-Mechanical Systems)
 
iMEMS® Ceramic Packages for Gyroscopes and Accelerometers (Copyright. Analog Devices, Inc. All Rights Reserved.)   Ceramic MCM Package for Accelerometer
(Courtesy of Colibrys S.A.)
   
DLP Chip Package  
DLP® Chip Package
(Courtesy of Texas Instruments, Inc.)
  Kyocera Standard Package Library available in CoventorWare®    
*iMEMS is a registered trademark of Analog Devices, Inc.
*DLP is a registered trademark of Texas Instruments, Inc.
*CoventorWare is a registered trademark of Coventor, Inc.
   

 Product Specifications
Structure
TYPE 1: Package + Seal RING   TYPE 2: Package + Seal META (or NON)
     
Cerdip Type Package
Cerdip Type Package

 Material Characteristics and Reliability
Material Characteristics
    Alumina
Items Units A440 A443K
Bulk Density - 3.6 3.7
Electrical      
Dielectric Constant (1MHz) - 9.8 9.6
Dielectric Constant (10GHz) - 9.8 -
tan delta (1MHz) ( 1 X 10-4) 24 5.0
tan delta (10GHz) ( 1 X 10-4) - -
Volume Resistivity (20°C) ohm-cm >1012 >1012
Thermal 1/°C    
  Thermal Expansion (40-400°C) ( 1 X 10-6/°C) 7.1 6.9
Thermal Conductivity W/mK 14.0 18
Specific Heat J/gK 0.78 0.79
Mechanical      
  Flexural Strength MPa 400 460
Young's Modulus GPa 310 310
Conductor      
  Material   W W
Sheet Resistance mohm /SQ 8 8
Tensile Strength Kgf/mm2SQ 4 4
Characteristic     High strength
Color of Ceramics   Brown/Black Brown/Black

Reliability Test Results
(Tested as package only)
Test Items Test Conditions Hermeticities
(Gross Leak only)
opens/shorts Conductive Resistances Conductive Resistances
Temp. cycle -65 to +150°C 1000 cycles 1000 cycles 1000 cycles 1000 cycles
High Temp. Torage +150°C 1000hours 1000hours 1000hours 1000hours
High Temp. Humidity 85°C -
85%RH
1000hours 1000hours 1000hours 1000hours
Thermal Shock -65 to +150°C 1000 cycles 1000 cycles 1000 cycles 1000 cycles
High Temp. Storage with Bias 150°C/5.5V 1000hours N/A 3000hours N/A
For reference purpose only.

Inquiries about this page

 Related site
Semiconductor Components

 Related link
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Pressed Ceramic Components
Image-Sensor Packages
Image-Sensor Packages
 
 
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