Organic Packages / Printed Wiring Boards

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Organic Package

Build-up Structure FC-BGA
FC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.
FC-CSP Substrates
In recent years, IC packages have become necessary to meet the market needs of small and thin substrates required for digital handset equipment.
Kyocera has been enhancing and improving SLC technologies to respond to the market demand for thin and small substrates.

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