Ceramic Packages

Kyocera provides multilayer ceramic substrates, with single-layer or multilayer thin-film metallization, for DRAM, flash memory and logic device (multi-DUT) wafer probe cards.

DRAM: Dynamic Random-Access Memory
DUT: Device Under Test

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  Single-Layer Thin-Film Metallization on
  Multilayer Ceramic Substrate for
  300mm DRAM Wafer Probe Card

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  Single-Layer Thin-Film Metallization on
  Single-Layer Ceramic Substrate for
  300mm Flash Memory Wafer Probe Card

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  Multilayer Thin-Film Metallization on
  Multilayer Ceramic Substrate (59mmSQ) for
  Logic Device (4-DUT) Wafer Probe Card

Multilayer Ceramic Substrate + Single-Layer Thin-Film Metallization

Multilayer Ceramic Substrate + Multilayer Thin-Film Metallization