Ceramic Packages

Kyocera provides standard and custom-designed ceramic packages, optically coated glasses, and chip assembly services for CCD and CMOS image sensors. Ceramic materials facilitate miniaturization through their high strength, rigidity, and the cavity structures they make possible. Additionally, ceramic materials help avoid dust contamination during assembly processes, making them the ideal substrate for image sensor applications. Kyocera also provides ceramic packages for both infrared and ultraviolet sensors.

CCD: Charge-Coupled Device
CMOS: Complementary Metal Oxide Semiconductor
CERDIP: Ceramic Dual Inline Package
CTE: Coefficient of Thermal Expansion

• Ceramic Leadless Chip Carriers (CLCC)

  

• Ceramic Packages with
  Cavity for Passive Components

  

• Optical Filters and Optical Windows

  

  More

  Substrate Materials

  • Borosilicate Glass
  • Blue Glass
  • Quartz Glass
  • Quartz Crystal
  • Sapphire
  • CZ Silicon
  • Germanium

  Optical Coating

  • Anti-Reflection (AR) Coating
  • Infrared (IR) Cut Coating

• CERDIP (C-DIP)

  

• An alumina package (CTE: 7.1-7.3ppm/K) is recommended for borosilicate glass lid applications (CTE: 7.2ppm/K).
• Epoxy resin pre-coated glass is available.
• Metal lid with glass window is available for hermetic sealing.
• Assembly service is available for epoxy-mounting IR cut filters to lens holders.