Ceramic Packages / Ceramic Substrates

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Mobility

See below for ceramic packages and lids used in automotive vehicles and mobility system applications.

　

Ceramic Packages / Lids for Quartz Crystal Devices

Ceramic Packages for SAW Devices

Ceramic Packages / Lids for Imaging Sensor

Ceramic Packages for Light Emitting / Sensing Devices

Ceramic Packages for Automotive Inertial Sensors

Ceramic Packages and Lids for Barometric Pressure Sensors

Ceramic Packages and Lids for Metal-Oxide Gas Sensors

Ceramic Packages for NDIR Gas Sensors

Ceramic Substrates for Plasma Generation

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Others

Low Electrical Loss

This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.

Ceramic Package Miniaturization

Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.

Hermetic Sealing

This page provides an overview of hermetic sealing technologies for protecting components from the external environments.

High Thermally Conductive Ceramics

By using materials with high thermal conductivity, heat generated by components is effectively dissipated.

Matching Coefficients of Thermal Expansion

By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.

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