Kyocera offers multilayer ceramic substrates for probe cards used to test semiconductor wafers. These probe cards exhibit a coefficient of thermal expansion close to that of the silicon wafer, with the exceptional rigidity and deformation resistance this application requires.
Requirements for Probe Cards
The card's coefficient of thermal expansion (CTE) must be close to that of the wafer material, such as silicon, to ensure accurate testing of the wafer's extremely small circuitry. Closely matching the CTE is essential because the wafer test is performed at higher temperatures, and both the wafer and the probe card expand as the temperature rises.
In addition, surface flatness is required because the probe cards have a great number of probe pins that must each contact the wafer evenly. Fine wiring is also required on the surface of the probe card to match the fine circuit patterns on the wafer surface.
Features: Kyocera Probe Cards
Ceramic Material Properties
- Low CTE (closer to Silicon)
- High Rigidity
Wiring Technologies
Fine Thin-Film Patterns
Multilayer Patterns
Other Characteristics
Large Substrate (Diameter: 330mm/12.99")
Manufacturing Process
