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Ceramic Packages for Automotive Pulse LiDAR

Automotive Pulse LiDAR Packages Automotive Pulse LiDAR Packages

Kyocera’s ceramic packages provide outstanding heat dissipation and heat resistance properties, contributing to reduced inductance for the entire LIDAR module.
Lower inductance packaging enables high power and narrow pulse width lasers.

  • Side-Widowed Package
    Side-Windowed
    Package
  • Island Package and Side-Windowed Lid
    Island Package
    and Side-Windowed Lid
  • Edge-Emitting Laser Package
    Edge-Emitting
    Laser Package
  • VCSEL Package
    VCSEL
    Package

Kyocera’s Pulse LiDAR Package Solutions

Package Technology for Long Distance Detection

Technical Requirements for Long Distance Detection
  • Increased Pulse Frequency
  • Additional Laser Power
  • Eye Safe Laser
Technical Challenges
  • Low Inductance requirements
  • Improved heat dissipation from laser

Low Inductance Packaging

Multilayer ceramic packaging can reduce inductance using a VIA structure design that results in shortened wire bond lengths.
(1) Optimization of VIA count
(2) Minimizing wire bond loop length with a cavity structure
(3) Parallel routing in two layers (patent pending)

Conventional TO-CAN Package
Conventional TO-CAN Package
Ceramic Package Technology
Ceramic Package Technology
* Pulse delay caused by inductance calculated using the formula below
Pulse delay caused by inductance calculated using the formula below
Reduce the Inductance in Routing Reduce the Inductance in Routing
  • 1Allocate Multiple VIAs（◿67％）
    Allocate Multiple VIAs Allocate Multiple VIAs

    Reduces inductance by allocating more VIAs in multilayer ceramics.

  • 2Minimizing Wire Length（◿54％）
    Minimizing Wire Length Minimizing Wire Length

    Reduces inductance by adding bonding shelf to minimize wire bond length.

  • 3Parallel Routing in Ceramics Connection through VIAs（◿31％）
    Parallel Routing in Ceramics Connection through VIAs Parallel Routing in Ceramics Connection through VIAs

    Reduces inductance by parallel routing within two ceramic layers and connection of VIAs

Improved Heat Dissipation from Laser

Adopting a high thermal conductive ceramic material provides improved heat dissipation from the device and suppresses the temperature rise, allowing for optimal laser diode performance.

Additional heat dissipation is required from the package to compensate for the integration of multiple functionalities. The benefit of using ceramic packaging and materials is the ability to integrate multiple components, such as multi-laser chips, photodiodes, steering devices, and Control ICs.

High Thermal Conductivity Ceramic Materials Line-up

◎: Excellent ○: Good △: Okay

Multilayer
Alumina		 Multilayer
Aluminum
Nitride		 CuW Embedded
Multilayer
Alumina
Kyocera Material Code A473 AN242 AO610W
Structure Design
A473
AN242
AO610W
Thermal Conductivity (W/mK) △　18 ◎　150
○　Alumina：17
CuW：200
Coefficient of Thermal Expansion (/K) ○　6.9×10-6 ◎　4.7×10-6 ○　6.8×10-6
Chip Connection Wire Bonding ◎ ◎ ◎
Flip Chip ◎ ○ △
Miniaturization ◎ ○ △
Cost Comparison for 3 Materials※ Low High Middle

Comparison between A473, AN242 and AO610W.

High Thermal Conductivity Ceramic Materials Line-up

Multilayer Alumina
Kyocera Material Code A473
Structure Design
A473
Thermal Conductivity (W/mK) △　18
Coefficient of Thermal Expansion (/K) ○　6.9×10-6
Chip Connection Wire Bonding ◎
Flip Chip ◎
Miniaturization ◎
Cost Comparison for 3 Materials※ 低
Multilayer Aluminum Nitride
Kyocera Material Code AN242
Structure Design
AN242
Thermal Conductivity (W/mK) ◎　150
Coefficient of Thermal Expansion (/K) ◎　4.7×10-6
Chip Connection Wire Bonding ◎
Flip Chip ○
Miniaturization ○
Cost Comparison for 3 Materials※ High
CuW Embedded Multilayer Alumina
Kyocera Material Code AO610W
Structure Design
AO610W
Thermal Conductivity (W/mK)
○Alumina：17
CuW：200
Coefficient of Thermal Expansion (/K) ○　6.8×10-6
Chip Connection Wire Bonding ◎
Flip Chip △
Miniaturization △
Cost Comparison for 3 Materials※ Middle

Comparison between A473, AN242 and AO610W.

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Single and Double-sided Mounting for Miniaturization and Cost Reduction

2D and 3D modules are required to achieve high performance, miniaturization, and lower cost. Therefore, the Laser, Driver IC, and Monitor PD are integrated into a single small-sized module.

  • 1.Challenge for 2D Modules

    Heat generated from the IC can impact the wavelength of the edge-emitting laser

    2d module

  • 2.Challenge for 3D Modules

    In addition to the heat impact on the laser wavelength, it may be difficult to create a mounting area on back side of package.

    3d module

Solutions

Kyocera has developed a unique forming and lamination process for manufacturing double-cavity structure packages in large volumes.

Integrating the laser, driver IC, monitor PD, and chip caps to 2D and 3D modules enable miniaturization and cost reduction.

In addition, this integration of devices provides the added benefit of reducing inductance with shorter routing lengths by having routing inside package.

Kyocera’s cavity and double-sided cavity packages provide improved module size and long-term performance.

CASE
1Edge-Emitting Laser (EEL) + Driver IC
Edge-Emitting Laser (EEL) + Driver IC
端面発光LD (EEL) + ドライバIC
Driver IC (Wire Bonded)
Side-Windowed Wire Bonding Package
Module Area: 8.40 x 7.00mm
端面発光LD (EEL) + ドライバIC
Driver IC (Flip Chip Bonding)
Side-Windowed Solder Pad Package
Module Area: 6.10 x 6.60mm

Reduces module size by 32% and eliminates wire bonds between the Driver IC and the laser, contributing to reduced electrical inductance.

CASE
2VCSEL + Driver IC
VCSEL + Driver IC
1.2D-Module (on Flat Substrate)
2D-Module (on Flat Substrate)
2.2D-Module (on Cavity Package)
2D-Module (on Cavity Package)
3.3D-Module
3D-Module
Chip Size (Estimation)
  • Monitor PD ：1×1mm
  • VCSEL：5×4mm
  • Driver IC ：3×6mm

1. and 2. : Reduced Module Size by 25%,
3. : Reduced Module Size by 40%.
Eliminates wire bonds between the Driver IC, EEL and VCSEL to enable reduced inductance.

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Comparison of TO-CAN and Ceramic Package

When comparing the thermal resistance of TO-CAN packages and ceramic packages with AlN (Aluminum Nitride), there is no change in the package’s thermal resistance, even with a significant size reduction. The maximum heat resistance of the package is approximately 50% lower than a TO-CAN package of the same size.

Surface Mount Ceramic Package (SMT Package)
Ceramic Package (Aluminum Nitride)
Thermal Simulation
Thermal Simulation
Ceramic (Aluminum Nitride)

Benefits of Leadless Packaging and Ceramic Substrate Materials

Ceramic leadless packages provide higher thermal conductivity and allow the thermal path to be routed through the backside of the package. This enables better heat dissipation than a traditional TO-CAN Package.

Advantages of Ceramic Packaging
Advantages of Ceramic Packaging

Surface mount ceramic package designs offer a lower profile module with a more effective thermal path than TO-CAN packages.

Additionally, ceramic packages reduce inductance by routing through multilayer ceramics. Therefore, the inductance of ceramic packages is about 50% lower than TO-CAN packages. (Example: Driver IC integrated module)

Inductance Simulation of Driver IC and Laser Diode

Package Configuration TO-CAN Ceramic Package
Structure
TO-CAN
Ceramic Package
Wiring / Routing Length (Driver IC – Laser Diode) (mm) 7.65 3.88
Inductance (nH) 4.24 1.94

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Ceramic Package Line-up

Kyocera develops a wide range of ceramic packages for nearly any type of laser.

Below is a list of Kyocera’s ceramic package offerings for different laser types

Laser Type Structure Thermal
Dissipation		 Substrate and Package Configuration
VCSEL Submount Moderate
Alumina Submount
Alumina Submount
High
Aluminum Nitride Submount
Aluminum Nitride Submount
Cavity
Package		 Moderate
Alumina Leadless Package
Alumina Leadless Package
High
  • Aluminum Nitride Leadless Package
    Aluminum Nitride Leadless Package
  • Alumina Package + Metal Heat Sink
    Alumina Package + Metal Heat Sink
Edge-Emitting LD
(EEL) 		Submount Moderate
Alumina Submount
Alumina Submount
High
Aluminum Nitride Submount
Aluminum Nitride Submount
Cavity
Package 		Moderate
  • Alumina Island Substrate + Side-Windowed Cap
    Alumina Island Substrate + Side-Windowed Cap
  • Side-Windowed Alumina Package
    Side-Windowed Alumina Package
High
  • Aluminum Nitride Submount + Side-Windowed Cap
    Aluminum Nitride Submount + Side-Windowed Cap
  • Side-Windowed Alumina Package + Metal Heat Sink
    Side-Windowed Alumina Package + Metal Heat Sink
  • Aluminum Nitride Substrate + Carrier
    Aluminum Nitride Substrate + Carrier

Lineup of ceramic packages by emmit direction

◎: Excellent ○: Good △: Okay

Emitting Direction Laser Type Configuration Structure X-Section Features Heat Dissipation Narrow Pulse Reliability Low
Profile
Miniaturization		 Package Cost
Horizontal Edge- Emitting LD (EEL) Island
Island
Island
Submount Eliminated
Lower Cost (Alumina)
Hermetic Package Available		 ○ ◎ ◎ ◎ ◎
Side Window
Side Window
Side Window
Submount Eliminated
Hermetic Package Available		 ○ ◎ ◎ ◎ ○
Couch
Couch
Couch
High Thermal Dissipation (AlN)
Submount Eliminated		 ◎ ◎ ◎ ◎ △
Substrate
Sub
Sub
High Thermal Dissipation (AlN) /
Good Flatness / Fine Design /
AuSn Pre-solder		 ◎ ○ ◎ ◎ ○
Vertical Edge-Emitting LD (EEL) CAN
CAN
CAN
AlN pre-attached TO CAN Package ○ ○ ◎ △ △
Cavity
バスタブ
バスタブ
High Thermal Dissipation (AlN)
Hermetic Package Available		 ◎ ◎ ◎ ◎ △
VCSEL Cavity
Cavity
Cavity
High Thermal Dissipation (AlN)
Hermetic Package Available		 ◎ ◎ ◎ ◎ △
Substrate
Substrate
Substrate
High Thermal Dissipation (AlN) /
Good Flatness / Fine Design /
AuSn Pre-solder		 ◎ ○ ◎ ◎ ○

Lineup of ceramic packages by emmit direction

Emitting Direction Horizontal
Laser Type EEL
Configuration Island Side Window Couch Substrate
Structure
Structure
Structure
Structure
Structure
X-Section
X-Section
X-Section
X-Section
X-Section
Features Submount Eliminated
Lower Cost (Alumina)
Hermetic Package Available		 Submount Eliminated
Hermetic Package Available		 High Thermal Dissipation (AlN)
Submount Eliminated		 High Thermal Dissipation (AlN) /
Good Flatness / Fine Design /
AuSn Pre-solder
Heat Dissipation ○ ○ ◎ ◎
Narrow Pulse ◎ ◎ ◎ ○
Reliability ◎ ◎ ◎ ◎
Low Profile Miniaturization ◎ ◎ ◎ ◎
Package Cost ◎ ○ ○ ○
Emitting Direction Vertical
Laser Type EEL VCSEL
Configuration CAN Cavity Cavity Substrate
Structure
Structure
Structure
Structure
Structure
X-Section
X-Section
X-Section
X-Section
X-Section
Features AlN pe-attached TO CAN Package High Thermal Dissipation (AlN) Hermetic Package Available High Thermal Dissipation (AlN) Hermetic Package Available High Thermal Dissipation (AlN) / Good Flatness / Fine Design / AuSn Pre-solder
Heat Dissipation ○ ◎ ◎ ◎
Narrow Pulse ○ ◎ ◎ ○
Reliability ◎ ◎ ◎ ◎
Low Profile Miniaturization × ◎ ◎ ◎
Package Cost × ○ ○ ○

Interested in Kyocera’s LiDAR packages and substrate materials?
Contact us for more details on our solutions.

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