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Ceramic Packages / Ceramic Substrates
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Technical Support

Simulation Technology
Kyocera’s simulation technologies can help optimize package designs for demanding requirements.
Sealing Options
Choosing the right sealing method can enhance reliability and performance.
Chip- and Board-Level Assembly Options
Package structure options offer flexibility to optimize your chip- and board-level assembly.
Delivery Options
Select from a variety of shipping form options to suit your existing production lines.

Others

Low Electrical Loss
This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.
Ceramic Package Miniaturization
Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.
Hermetic Sealing
This page provides an overview of hermetic sealing technologies for protecting components from the external environments.
High Thermally Conductive Ceramics
By using materials with high thermal conductivity, heat generated by components is effectively dissipated.
Matching Coefficients of Thermal Expansion
By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.
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