Kyocera recommends SHDBU substrates for high-speed with high I/O count flip chip BGA. SHDBU substrates have high-density build-up and CPCORE as a core material, which allows for a finer design rule than with conventional core materials making them thin and displaying good characteristics for high speed applications.
In addition to fine geometry routing at the build-up layer, routing in CPCORE is possible, so it is a suitable technology for full area array flip chip assembly and MCM. Furthermore, critical routing is possible in the CPCORE layer, and is suitable for high speed switching devices and high speed routers.
SHDBU Cross Section (2-4-2)
|Layer Structure||Up to 4-n-4|
|Core Layer Structure||5 ~ 25|
|Build up Line Width / Space||9μm / 12μm|
|Core Line Width / Space||40μm / 40μm|
|Flip Chip Pad Pitch||125μm|
Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes.
Please feel free to contact us for further information.