CPCORE processes features of both multilayer ceramic technology and multilayer organic technology, and complies with 175µm via pitch routing and all layer stacked via.
CPCORE material is flexible in routing design, which contributes to the enhancement of electrical performance. CPCORE is suitable for semiconductor packages where high speed signal transmission is required.
Exsample for 21 layers
|Layer Structure||3 to 25|
|Line Width / Space||30μm / 30μm|
|Via Hole / Land Diameter||100μm / 170μm||*Standard Rule|
|85μm / 145μm||*Advanced Rule|
|Flip Chip Pad Pitch||175μm|
Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes. Please feel free to contact us for further information.