Organic Packages / Printed Wiring Boards

CPCORE Structure Type

CPCORE processes features of both multilayer ceramic technology and multilayer organic technology, and complies with 175µm via pitch routing and all layer stacked via.
CPCORE material is flexible in routing design, which contributes to the enhancement of electrical performance. CPCORE is suitable for semiconductor packages where high speed signal transmission is required.

Features

Thermosetting PPE (polyphenyl ether) implemented; enhancing high frequency characteristics
175µm BGA pad pitch enables full area array. Stacked via for all layers
Ideal micro strip structure available
Full layers stacked via and high density pad pitch facilitate high frequency design

Cross Section

Exsample for 21 layers

Specifications

Item	Specification	Note
Layer Structure	3 to 25
Line Width / Space	30μm / 30μm
Via Hole / Land Diameter	100μm / 170μm	*Standard Rule
	85μm / 145μm	*Advanced Rule
Flip Chip Pad Pitch	175μm
Via Pitch	175μm

Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes. Please feel free to contact us for further information.

Applications

LSI for servers and high-speed network devices
LSI for high-speed use

Our Experts can help