Organic Packages / Printed Wiring Boards

High-Density Multilayer PWBs

High-Density multilayer PWBs for high perforemance network equipment and industrial equipment

Our layer count is up to 50 layers and the PWB size is up to 780mm x 570mm. Advanced manufacturing technologies for stack via, skip via, back drill for high speed signal and buried capacitors support higher performance and high-density design of equipment.

Features

High aspect ratio via holes support high-density multilayer PWBs and PWBs with sequential lamination supports flexibility of design
Technology of back drill and accurate impedance control support signal integrity
Maximum 210μm thick copper support supply of large current on PWBs

Specifications

Item	Specification	Note
Number of layers	4-50	High multilayer multiplex laminated board
Total thickness	0.4-7.0mm	0.06mm thickness core material (buried capacitance material: 0.025mm)
Material	FR-4, FR-5eq., etc.	Various low dielectric materials, BT-Resin, Polyimide
Maximum no. of build-up layers	3	Available skip via
Maximum board size	477mm × 699mm
Aspect ratio (Max.)	20
Through hole	BVH, IVH	Via structure: IVH on 2 stacked via
Line width / space (Min)	80μm/100μm (Outer Layer)	75μm/75μm (Inner Layer)
Back drill	Drill Diameter +0.15mm	Special design

Structure (Example of Cross Sectional View)

Applications

High performance computers
Network equipment
Communication equipment
LSI testers
Base transceiver stations

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