Electrostatic Chucks (ESCs)

PHOTO: Electrostatic Chucks (ESCs)

High plasma-resistant chucks perform well in a wide range of operating temperatures.

An internal electrode is embedded to utilize the electrostatic force generated between this structure and the Si wafer placed on the ESC surface. This product is used for silicon wafer mounting, flatness correction and cooling the silicon wafer during the semiconductor manufacturing process.

Features

  • Plasma Resistance
We support custom products from prototypes to mass-production runs. Please contact us to explore options, even if your specifications are different from those shown on our Web site.
Inquiries
  • Product specs

Product specs

Material Alumina, Aluminum Nitride
Size For φ200/300mm equipment
Download catalog

Ceramic Components for Semiconductor Processing(PDF/3.0MB)PDF