Heat Dissipation Structure Ceramic Substrates

Electrostatic Chucks (ESCs)

Highly plasma-resistant chucks perform well in a wide range of operating temperatures.

An internal electrode is embedded to utilize the electrostatic force generated between this structure and the Si wafer placed on the ESC surface. This product is used for silicon wafer mounting, flatness correction and cooling the silicon wafer during the semiconductor manufacturing process.

Property

Plasma Resistance

Product specs

Material
Alumina, Aluminum Nitride
Size
For φ200/300mm equipment

Applications

  • Wafer Holding
  • Flatness Correction
  • Cooling

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