SiC (Silicon Carbide) Polishing PlatesLess deformation through lower thermal distribution. Stronger chemical resistance. A range of surface profiles are available.
Polishing plate features minimal deformation due to high thermal conductivity, low thermal expansion coefficient, high stiffness and excellent thermal uniformity. It also features excellent chemical resistance and various surface profile options including concave, flat or convex.
- Silicon Carbide
- Convex, flat and concave available.
- Flatness: 1μm or less
- Wafer Polishing