SiC (Silicon Carbide) Polishing Plates

PHOTO: SiC (Silicon Carbide) Polishing Plates

Less deformation through smaller thermal distribution. Stronger chemical resistance. Various surface profiles are available.

Polishing plate features minimal deformation due to high thermal conductivity, low thermal expansion coefficient, high stiffness and excellent thermal uniformity. It also features excellent chemical resistance and various surface profile options including concave, flat or convex.


  • High Thermal Conductivity
  • Low Thermal Expansion
  • High Stiffness
  • Thermal Uniformity
  • Chemical Resistance
We support custom products from prototypes to mass-production runs. Please contact us to explore options, even if your specifications are different from those shown on our Web site.
  • Product specs

Product specs

Material Silicon Carbide
Shape Convex, flat and concave available.
Size MAXφ30"
Precision Flatness: 1μm or less
Download catalog

Ceramic Components for Semiconductor Processing(PDF/3.0MB)PDF