Heat Dissipation Structure Ceramic Substrates

Feedthroughs (Multi-pin)

Multi-pin terminal feedthroughs are based on advanced ceramic-to-metal bonding technology.

Kyocera offers a wide variety of feedthrough connectors, based on our ceramic-to-metal bonding technology and many years of experience in the ultra-high vacuum fields including radiation light source and aerospace. These open tool products meet the specifications of standard coaxial connectors and multi-pin connectors. They are used in a wide range of applications from cutting-edge technology and science, such as radiation light source and nuclear fusion, to industrial equipment such as semiconductor processing equipment.

Property

Hermeticity Bonding Technology

Product specs

Material
Metallized Components
Air tightness
1.3×10-10 Pa/m3/s or less
Anti heat temperature
300℃ or less (baking temperature)

Applications

  • Feedthroughs for Scientific Equipment, Semiconductor Processing Equipment, Industrial Manufacturing Equipment

Download catalog / technical data

Search