Heat Dissipation Structure Ceramic Substrates

PHOTO: Heat Dissipation Structure Ceramic Substrates

Monolithic ceramic structure with no bonding material for long-term reliability.

- Cooling or heat exchanging components made of light
  weight ceramic with low heat capacity provide a more
  efficient, energy saving system compared to metal.
- Design possibility for thin wall or complex structure.
- Long term, efficient cooling and temperature control.
- Low maintenance cost due to superior chemical durability.
- Applicational exploitation other than cooling or
  temperature control.

Features

  • High efficiency heat exchange
  • Bonding Technology
  • Chemical Resistance
  • Design flexibility
  • High temperature durability
We support custom products from prototypes to mass-production runs. Please contact us to explore options, even if your specifications are different from those shown on our Web site.
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  • Product specs
  • Features
  • Applications

Product specs

Download catalog

Fine Ceramics for Electronics(PDF/5.0MB)PDF

Material  Alumina, Silicon Carbide
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Features

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Applications

Heat Element Cooler

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Cross-sectional structure diagram

Thermal Control Component

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Cross-sectional structure diagram

Heat exchanger components

Manifolds


Micro reactors

Thermal insulation components