Super Heat Dissipation Substrate AtsuDo™

PHOTO: Super Heat Dissipation Substrate AtsuDo™

Excellent endothermic performance, utilizing copper's 386W/m·K thermal conductivity

- Thick copper (more than 1mm thickness) bonded on
  top of strong ceramic substrate
- Excellent transient heat dissipation, with high heat
  capacity of thick copper
- High electrical insulation as well as heat dissipation
  by using silicon nitride as substrate
- Substrate can also be made from other ceramic
  materials. Please contact us for possibility.
* "AtsuDo" is a trademark of Kyocera Corporation

Features

  • High Thermal Conductivity
  • Electrical Insulation
We support custom products from prototypes to mass-production runs. Please contact us to explore options, even if your specifications are different from those shown on our Web site.
Inquiries
  • Product specs
  • Features

Product specs

Material Silicon Nitride / Aluminum Nitride / Alumina / Single Crystal Sapphire

Features

■ Combination Example of Substrate Material and Layer Material


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■ Simulation on Heat Dissipation
(In case of 1” sq. substrate, comparison between 0.3mm and 1.5mm thick bonded Cu)


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