Electronic Components & Devices

Glossary of electronic components

Power Devices

A


Anode    An electrode through which a current flows into a polarized electrical device
Average rectified output current (Io)    [Diode] Maximum average forward current of commercial frequency (50Hz/60Hz) sin wave under condition.
[Thyristor] Maximum average on-state current of commercial frequency (50Hz/60Hz) half sin wave under specified condition.

C


Cathode    An electrode from which a current leaves a polarized electrical device.

D


Diode   A two-terminal semiconductor device which conducts current in one direction, i.e. from anode to cathode, also called a rectifier.
DIP   A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.

E


EMC   Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.
EMI   Abbreviation of Electromagnetic Interference. A disturbance of an electrical circuit caused by external interference of an electromagnetic origin.
EMS   Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a distrbance of electromagnetic origin.
Equivalent Series Resistance   The equivalent series resistance is the resistive element of the quartz crystal equivalent circuit. This resistance represents the equivalent impedance of the crystal at series resonance.

G


Gate trigger current(IGT   Minimum gate current required to turn on.
Gate trigger voltage   Minimum gate voltage required to turn on.

I


IGBT   Abbreviation of Insulated Gate Bipolar Transistor. A type of three-terminal power semiconductor device, with an insulated gate which controls the current flowing through the device. An IGBT features the voltage-drivencharacteristics of MOSFETs in addition to the high-current capability of bipolar transistors.

M


MOSFET   Abbreviation of metal-oxide-semiconductor field-effect transistor. A type of field-effect transistor (FET) with an insulated gate that controls current flowing through a device.

O


Operating channel Temperature Range(Tjw   [MOSFET] Range of channel temperature while operating.
[Diode / Thyristor] Range of junction temperature while operating.

P


Peak Forward Voltage(VFM   Peak forward voltage at specified forward current.
Peak reverse current(IRM   Peak reverse current at specified reverse voltage.
Power dissipation(PD   Maximum allowable power dissipation at 25℃.

R


Reflow Soldering   A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).
Repetitive Peak Off-state Voltage(VDRM   Allowable peak off-state voltage repetitively applicable between anode and cathode.
Repetitive Peak Reverse Voltage(VRRM   [Diode]Allowable peak reverse voltage repetitively applicable to diode.
[Thyristor]Allowable peak reverse voltage repetitively applicable between anode and cathode.
Reverse Recovery Time(trr   Time required to recover blocking capability after current is switched from forward to reverse.

S


SMD   Abbreviation of Surface Mount Device. Components suitable for SMT equipment.
SMT   Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.
Source Current(IS   Maximum allowable current into source terminal.
Source-Drain Voltage(VSD   Voltage between source and drain terminals at specified source current with gate short-circuited to source.
Static Drain-Source On-resistance(RDS(on)   DC resistance between drain and source at specified gate voltage and drain current.
Storage Temperature Range(Tstg   Range of ambient temperature while not operating.
Surge forward current(IFSM   Non-repetitive maximum peak forward current in one cycle of 50Hz sin wave.
Surge on-state current(ITSM   Non-repetitive maximum peak on-state current in one cycle of 50Hz sin wave.
Surge Peak Reverse Voltage(VRSM   Allowable peak reverse voltage non-repetitively applicable to diode.

T


Thermal Resistance(Rth   Temperature difference per watt between two points, such as junction and ambient, or junction and case after thermal balance is established Rth(j-c): junction to case, Rth(j-l): junction to lead, Rth(j-a): junction to ambient
Thyristor   A type of three-terminal power semiconductor device that conducts high current when the gate receives a current trigger.
Transistor   A semiconductor device used to amplify or control current.

Crystal Devices

C


Crystal Impedance    Equivalent impedance of the crystal at series resonance.
Crystal Oscillator    An oscillator is a module consisting of a crystal unit and an oscillation circuit. An oscillator can obtain stable frequency signals by applying the supply voltage.
Crystal unit    Crystal unit is a passive component using piezoelectric effects of a crystal.

D


DIP   A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.
Drain Current(ID   Maximum allowable continuous value of drain current.
Drain-Source Voltage(VDSS   Allowable peak voltage between drain and source with gate short-circuited to source.

E


EMC   Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.
EMI   Abbreviation of Electromagnetic Interference. A disturbance of an electrical circuit caused by external interference of an electromagnetic origin.
EMS   Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a distrbance of electromagnetic origin.

F


Frequency stability over temp.   Frequency variation caused by temperature changes referenced to the frequency at 25 deg.C.
Frequency tolerance   Max. frequency deviation from the nominal frequency. Specified in 10-6.

L


Load capacitance   Capacitance decided by the oscillation frequency of the crystal in the circuit.
Load Resonance frequency   Resonance frequency when a crystal unit is connected to load capacitance in series.

P


Photolithography   Photolithography is a process used in microfabrication mainly for the semiconductor industry.
ppm   Abbreviation of parts per million. Used as 10-6 when referring to the crystal frequency tolerance.

R


Reflow Soldering   A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).

S


Simple Packaged Crystal Oscillators(SPXO)   Simple Packaged Crystal Oscillators consist of crystal units and an oscillation circuit.
SMD   Abbreviation of Surface Mount Device. Components suitable for SMT equipment.
SMT   Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.

T


Temperature Compensated Crystal Oscillator(TCXO)   Temperature Compensated Crystal Oscillator, which has a built-in circuit to correct frequency variations resulting from temperature variations of the crystal unit.

V


Voltage Controlled Crystal Oscillator(VCXO)   A Voltage Controlled Crystal Oscillator, which features a variable capacitance component such as a diode inserted into a SPXO oscillation loop, enables control of the oscillation frequency by varying the voltage of the external power supply.

SAW Devices

A


Attenuation    The reduced level of unnecessary signals.
Attenuation Width    The frequency width of unnecessary signals to be reduced.

B


Band Pass Filter    Electronic component which allows a range of specified frequencies to pass.

D


DIP   A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.

E


EMC   Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.
EMI   Abbreviation of Electromagnetic Interference. A disturbance of an electrical circuit caused by external interference of an electromagnetic origin.
EMS   Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a distrbance of electromagnetic origin.

F


FDD   Abbreviation of Frequency Division Duplex. The duplex which realizes simultaneous communication of Tx and Rx by using different frequency bands.

I


Impedance   The opposition to current flow in a circuit, including resistance, inductance, and capacitance.
Isolation   Signal division between Tx (Transmit) and Rx (Receive).
Insertion Loss   The loss of signal power resulting from the insertion of a device in a transmission line or optical fiber.

L


Low Noise Amplifier   Electronic component which amplifies low-power signals without degrading its signal-to-noise ratio.

P


Photolithography   Technology which prints fine patterns on a wafer by certain exposure treatments during development. Features high accuracy and mass production capability.
Power Amplifier   Electronic component which amplifies a signal to achieve a higher frequency for transmission.

R


Reflow Soldering   A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).
Ripple   Gap between the highest point and lowest point of loss within a passband.

S


SAW Duplexer   Electronic component which isolates Tx and Rx signals by applying a surface acoustic wave.
SAW Filter   Electronic component which applies surface acoustic waves. Band pass filters, high pass filters, band eliminating filters, and duplexers are included in this category.
SMD   Abbreviation of Surface Mount Device. Components suitable for SMT equipment.
SMT   Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.

T


TDD   Abbreviation of Time Division Duplex. The duplex which realizes simultaneous communication by dividing the band into different time slots, switching between Tx and Rx in high speed.

V


VSWR    Abbreviation of Voltage Standing Wave Ratio. A measure of how efficiently radio-frequency power is transmitted from a power source, through a transmission line, into a load.

Capacitors

A


AC voltage characteristics    Change of capacitance against the AC voltage.
Aging    The decrease of capacitance over time.

B


Bypass, Decoupling    To filter out high frequency noise and to decouple one part of an electrical circuit from another.

C


Capacitance    Index of the ability of how much potential energy can be stored. Unit is "F".
Capacitor    1.Stores DC power, enabling charge and discharge.
2.An electronic component which passes the AC (signal and/or high-frequency noise) through and prevents DC.
Coupling    To eliminate the DC voltage and only pass AC signals through.

D


Dielectric constant   The measurement of the ability of a dielectric to store potential energy in external electric fields.
Dielectric tangent   Index of energy loss caused due to the resistivity of dielectric and electrode material.
Dielectrics   Substance that can be polarized in external electric fields and stores DC power.
DIP   A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.

E


EMC   Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.
EMI   Abbreviation of Electromagnetic Interference. A disturbance of an electrical circuit caused by external interference of an electromagnetic origin.
EMS   Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a distrbance of electromagnetic origin.
ESL   Abbreviation of Equivalent Series Inductance. One of the resistive components in an AC circuit. ESL describes the inductive portion of the impedance of electronic components.
ESR   Abbreviation of Equivalent Series Resistance. One of the resistant components in an AC circuit. ESR depends on dielectric loss caused by the dielectric material and resistivity of the electrode material.

I


Insulation resistance   The extent to which a dielectric material resists leakage current measured under DC voltage.

P


Polarization   The charge orientation in dielectrics. Dielectric crystals contain positive and negative sides due to the structure in external electric fields.

R


Reflow Soldering   A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).

S


SMD   Abbreviation of Surface Mount Device. Components suitable for SMT equipment.
Smoothing   To suppress the ripple and smooth the voltage fluctuation.
SMT   Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.

Connectors

A


Actuator    [FPC/FFC connector] latch with a locking mechanism that is actuated when connecting FPC/FFCs for retention.

B


Boss    Protrusions made by an embossing work. On connectors, a cylindrical protrusion(s) formed on an insulator housing for positioning the connector on a board. Also known as pegs.

C


Characteristic impedance    Impedance is a value indicating resistance to AC currents, and it varies with frequency.Characteristic impedance is the impedance of a signal path, usually set to a certain value in equipment or a system.
Connector    A connecting device including accessories to join electrical circuits or equipment together.
Contact    Terminals, leads or pins contained in connectors, or also contacting part of the terminal/lead/pin. Metal parts or metallic portions responsible for conducting electricity when connectors are mated or connected. There are various kinds of contacts, such as tuning forks and bellows.
Contact effective length    The distance on the surface of a contact on which another contact touches and travels during mating/unmating or contact margin.
Contact margin    Length of the surface of contacts that are touching one another during insertion or withdrawal. Means contact effective length.
Crack    Cracking of resin parts, cracking that extends to the inside due to external force and the like.

D


DIP   A method of mounting components on a printed circuit board (PCB) by inserting component leads to be soldered into through-holes of a PCB and dipping it into a solder bath to mount the components.
Dimple   Dent on a portion of a contact, the protrusion formed on the other side of a dent accommodates the wiping effect. The holding strength by insulator housing is improved with the protruded part.

E


Embossed tape   A carrier tape containing electronic components for surface mounting on PCBs. The tape itself is a packing material for SMT. The carrier tape with pockets holding the individual components that are sealed by a cover tape is called Embossed Tape Assembly or Tape & Reel Package.
EMC   Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.
EMI   Abbreviation of Electromagnetic Interference. A disturbance of an electrical circuit caused by external interference of an electromagnetic origin.
EMS   Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a distrbance of electromagnetic origin.

F


FFC   Abbreviation of Flexible Flat Cable. Multiple thin rectangular conductors at regular intervals laminated with aninsulating sheet.
Flux   It is an activator that improves solderability, and has oxide film removal and thermal conductivity effects.
FPC   Abbreviation of Flexible Printed Circuit. Circuit is printed on a thin insulating sheet with a conducting material.

I


Insulator   An insulating body or generic name for insulating materials constituting the outer shell of a connector that holds or accommodates contacts or post pins. It is also called a housing or mold.

K


Kink   Solder tails are bent in order to firmly connect a board with a connector to prevent contacts from floating when soldered.

L


LIF   [FPC/FFC Connector] Abbreviation of Low Insertion Force. A contact structure designed to suppress the mating force, while allowing enough force to retain a FFC/FPC.

M


Mating   To combine a connector to a compatible part for the purposes of transferring electricity.

N


Non-ZIF   [FPC/FFC Connector] Property of connectors that do not have a ZIF structure. FPC/FFCs are inserted directly into this type of connector, relying on contact friction to retain the FPC/FFC.

P


Pin count   Number of terminals/leads/circuits/contacts/ways contained in a connector.
Pitch   Spacing between contacts. Center-line spacing of adjacent contacts.
Press-fit   A solderless method to mount components on a printed circuit board. Contacts are pressed into through holes of a printed circuit board to make a conductive connection. Because it is solderless, no solder bridges, contact failure due to flux splash or penetration, or thermal deterioration of material will occur.
Profile Heigh   Connector height from the board surface to the top face of the mounted connector.

R


Reflow Soldering   A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).
Right-angle type   A horizontal connection type. Connectors oriented in a way where the mating portion of the contacts are parallel to the mounting surface.

S


Shell   Composed of an outer shell of a connector, to protect the insulator and secure the housing and aligns connectors to be mated. It has a structure to which necessary metal or the like can be attached. Also serves as a countermeasure against noise in high frequency (high-speed transmission) signals.
SMD   Abbreviation of Surface Mount Device. Components suitable for SMT equipment.
Smoothing   To suppress the ripple and smooth the voltage fluctuation.
SMT   Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.
Stacking height   Distance between the two surfaces that the connectors are mounted on.
Standoff   Distance space provided between connector bottom and board surface for securing mounting space or preventing flux-wicking.
Straight type   A vertical connection type. Connectors oriented in a way that the mating portion of the contacts are perpendicular to the mounting surface.

U


Unmating   Separating mated connectors or removing a mated object from a connector.

W


Whisker   Growing hair-like crystals generated on the surface covered with tin-based plating or the like. Temperature, humidity, stress, and / or atmosphere prompt growth. The grown hair-like crystal would come into contact with adjacent parts (such as contacts), resulting in a short circuit.
Wiping effect   The action in which a connector contact rubs the mating surface of another contact eliminating oxides/foreign substances adhering to the surface.

Z


ZIF   [FPC/FFC Connector] Abbreviation of Zero Insertion Force. When inserting or removing a FFC or the like to/from a ZIF connector,the actuator reduces insertion/removal forces by eliminating the need for friction of the conacts to retain the FFC or the like. All Non-ZIF type connectors do not have this structure.


For AVX products, enter from here.

Inquiries about products and technical information

Please feel free to contact us. Our staff will reply to your inquiry.

Inquiries by E-mail