Glossary of electronic components
The frequency width of unnecessary signals to be reduced.
Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.
Abbreviation of Electromagnetic Interference. A disturbance of an electrical circuit caused by external interference of an electromagnetic origin.
Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a disturbance of electromagnetic origin.
Abbreviation of Frequency Division Duplex. The duplex which realizes simultaneous communication of Tx and Rx by using different frequency bands.
The opposition to current flow in a circuit, including resistance, inductance, and capacitance.
Signal division between Tx (Transmit) and Rx (Receive).
Electronic component which amplifies low-power signals without degrading its signal-to-noise ratio.
Technology which prints fine patterns on a wafer by certain exposure treatments during development. Features high accuracy and mass production capability.
Electronic component which amplifies a signal to achieve a higher frequency for transmission.
A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).
Electronic component which isolates Tx and Rx signals by applying a surface acoustic wave.
Electronic component which applies surface acoustic waves. Band pass filters, high pass filters, band eliminating filters, and duplexers are included in this category.
Abbreviation of Surface Mount Device. Components suitable for SMT equipment.
Abbreviation of Time Division Duplex. The duplex which realizes simultaneous communication by dividing the band into different time slots, switching between Tx and Rx in high speed.
Abbreviation of Voltage Standing Wave Ratio. A measure of how efficiently radio-frequency power is transmitted from a power source, through a transmission line, into a load.