Glossary of electronic components
A
The reduced level of unnecessary signals.
The frequency width of unnecessary signals to be reduced.
B
Electronic component which allows a range of specified frequencies to pass.
E
Abbreviation of Electromagnetic Compatibility. The concept of enabling electronic devices to function without EMI.
Abbreviation of Electromagnetic Interference. A disturbance of an electrical circuit caused by external interference of an electromagnetic origin.
Abbreviation of Electromagnetic Susceptibility. The vulnerability of an electric circuit to a disturbance of electromagnetic origin.
F
Abbreviation of Frequency Division Duplex. The duplex which realizes simultaneous communication of Tx and Rx by using different frequency bands.
I
The opposition to current flow in a circuit, including resistance, inductance, and capacitance.
Signal division between Tx (Transmit) and Rx (Receive).
The loss of signal power resulting from the insertion of a device in a transmission line or optical fiber.
L
Electronic component which amplifies low-power signals without degrading its signal-to-noise ratio.
P
Technology which prints fine patterns on a wafer by certain exposure treatments during development. Features high accuracy and mass production capability.
Electronic component which amplifies a signal to achieve a higher frequency for transmission.
R
A soldering method in which solder is applied to electronic components and then melted in a reflow oven to permanently mount them to a printed circuit board (PCB).
Gap between the highest point and lowest point of loss within a passband.
S
Electronic component which isolates Tx and Rx signals by applying a surface acoustic wave.
→SAW Duplexers
Electronic component which applies surface acoustic waves. Band pass filters, high pass filters, band eliminating filters, and duplexers are included in this category.
→SAW Filters
Abbreviation of Surface Mount Device. Components suitable for SMT equipment.
Abbreviation of Surface Mount Technology. A method of producing electronic circuits on a printed circuit board (PCB) by applying solder paste and placing components on the PCB's surface before the solder is melted in a reflow oven.
T
Abbreviation of Time Division Duplex. The duplex which realizes simultaneous communication by dividing the band into different time slots, switching between Tx and Rx in high speed.
V
Abbreviation of Voltage Standing Wave Ratio. A measure of how efficiently radio-frequency power is transmitted from a power source, through a transmission line, into a load.
