Board to Board Connectors

Specifications

Features

• Kyocera’s original S-shaped spring is adopted for the spring structure, which realizes a low profile.
• A pinching structure (two-point contact design) is adopted to enhance resistance to vibrations or drop shocks . The Twin-rib structure of the contact on the plug side eliminates foreign matters such as scattered flux and chips from board separation and ensures high contact reliability.
• An original locking structure is adopted for the mating lock structure, which generates a firm “click” sound and enhances the retention force when connectors are removed despite the low profile.
• Connectors with or without boss are available.
• There is little dead space as metal is not exposed on the back of the connector. Thus, it is possible to form wiring patterns on the substrate area which is positioned between the terminals, realizing a suitable structure for high-density packaging.
• Contact Material: Copper alloy
• Insulator Material: Heat-resistant plastic
• Operating Temperature Range: -40 to +85°C

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