When using adhesives before soldering the capacitors to the printed wiring board, confirm the application conditions or consult component manufacturers. Capacitor performance may deteriorate if land pattern size, type or amount of adhesive, curing temperature, curing time, etc. is unsuitable.
Certain types of adhesive may deteriorate the insulation resistance. Differences in coefficients of thermal expansion (CTE) between the adhesive and capacitors may cause cracks in the capacitors.
If adhesive amount, curing temperature and/or curing time are insufficient, capacitors may be misaligned or fall off during handling or soldering.
When adhesive amount is excessive, adhesive that overflows to the land area may cause poor soldering, conductivity, curing and/or alignment.
If curing temperature and/or time is excessive, capacitor termination and board land surfaces might oxidize so much that adhesion strength and solderability of capacitors may deteriorate.
|b||70μm to 100μm|
|c||No contact with land pattern|
|Dispensed adhesive||After mounting capacitor|