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Sulfur free EMC for high reliability (New development product)

Good adhesion strength and excellent MSL performance although sulfur free.

graph

  • High reliability by sylfur free and low impurity
  • For Cu & Ag wire application
  • High flowability for thin wire
  • Good reflow performance

Application

  • For automotive
  • For high power device
Product Grade XKE-G8502 XKE-G8503
Application QFP,SOP,QFN,PLCC DPAK,D2PAK
Propertis
Spiral flow (100kgf) [cm] 167 126
Gel time [s] 33 30
Flow viscosity [Pa.s] 7 10
C.T.E alpha1 [ppm/℃] 8 7
alpha2 [ppm/℃] 30 26
Impurity
Cl- [ppm] 2.1 1.9
Sulfur [ppm] N.D. N.D.

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