close

Organic Materials

Japanese site

Conductive Pastes for Electronic Components

電子部品用onPCB_img1

Our paste for electronic components possesses desirable characteristics for use as an adhesive for capacitors and quartz resonators. For customers working to reduce cost, we also have a lineup of paste products with a silver -coated conductive filler. Please consider using this low-cost alternative and we will gladly introduce our product lineup to you.

Characteristics

Low resistivity
CharacteristicUnitCT233KFCT2823
Viscosity Pa·s 80 24
Elastic modulus GPa 9.5 14.5
Tg °C 120 80
Thermal conductivity W/m・k 6 -
Electrical conductivity ohm・cm 1×10-4 4×10-6
Adhesive strength
25°C
N/mm2 30 20
Cure condition
(In-line)
-

150℃x1.0h

150℃x10min
+200℃x1.0h

Applied chip size - 1~4mm -

Characteristic

Low pollution
from outgassing
in tantalum capacitor
applications
Electrode formation
of chip inductor
Low resistivity
Sintering Type

Viscosity: E-type 3 degree cone, Value of 0.5min-1 / Modulus: DMA25°C / Tg: DMA / Adhesive strength: Cu-Ag plating flame vs. Bare-Si (2x2mm□)

Back to TOP