Our pastes are an environmentally friendly product created as a substitute to lead solder. They have the highest level of thermal conductivity in the industry for high-density silver filling, as well as also possessing high electrical conductivity. Therefore, it has been favored by many customers since its development. By applying our product adoption qualifications, technical know-how and research accumulated as a market pioneer, we have succeeded in developing a low-temperature cure and low-stress paste.
In our rapidly developing smart-wired society, energy control is expected to become a quintessential technology. Please consider our high thermal conductive paste for various power devices, such as power IC/LSIs and power LEDs.
|Applied chip size||2～8mm□||～4mm□||～6mm□|
|High electrical and
corresponding large-size chips