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EMC for Finger Print Sensor

Higher DK of EMC can improve the sensor sensitivity. The product line-up which corresponds to thinning of the mold cap on the sensor is also enriched.

■For thick package design (High DK)
Reccomended product: KE-G1255BAS series, KE-G1255BTS series

■For thin package design (Normal DK with Fine filler and applicable comppression molding)
Reccomended product: KE-G1250AH-F series

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