Higher DK of EMC can improve the sensor sensitivity. The product line-up which corresponds to thinning of the mold cap on the sensor is also enriched.
■For thick package design (High DK)
Reccomended product: KE-G1255BAS series, KE-G1255BTS series
■For thin package design (Normal DK with Fine filler and applicable comppression molding)
Reccomended product: KE-G1250AH-F series