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KE-G3000 Series High Adhesive EMCs

表面実装用封止材

Excellent reflow performance through high adhesive strength

Features

  • Excellent reflow performance through high adhesive strength
  • Excellent high temperature storage performance
  • We have a variety of EMCs which are suitable for various frames, such as Copper, 42Alloy and Pd/Au plated

Applications

  • Automotive
  • Electronics
  • Applicable Packages:
    TSOP, SOP, QFP, QFN, DIP, TO, High-Voltage Diode
Application
TSOP,SOP,QFP QFN DPAK,D2PAK
Feature High adhesion strength
Low water absorption
Good warpage performance
High adhesion to PPF
High adhesion strength
Good MSL performance by low modulus
Recommended product KE-G3000D series
KE-G6000D series   (Low alpha ray grade)
KE-G3000N series KE-G3000DM series

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