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KE-G3000 Series High Adhesive EMCs

表面実装用封止材

Excellent reflow performance through high adhesive strength

Features

  • Excellent reflow performance through high adhesive strength
  • Excellent high temperature storage performance
  • We have a variety of EMCs which are suitable for various frames, such as Copper, 42Alloy and Pd/Au plated

Applications

  • Automotive
  • Electronics
  • Applicable Packages:
    TSOP, SOP, QFP, QFN, DIP, TO, High-Voltage Diode
GradeKE-G3000D
Feature Standard
Spiral Flow (cm) 105
Gelation Time (s) 20
Flow Viscosity (Pa•s) 10
Tg (°C) 120
CTE α1 (ppm/K) 10
CTE α2 (ppm/K) 38
Flexural Modulus @RT (GPa) 23
Impurity Cl- (ppm) 8
Thermal Conductivity (W/mK) 0.9

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