These EMCs can cover package types ranging from TO92 to SMD, and are excellent in terms of both curability and filling performance for inline processes.
- KE-G300 Series has good filling performance for ultra-small packages.
- Able to meet JEDEC MSL Level 1 requirements for ultra-small packages.
- Excellent adhesive strength even under high reflow temperatures.
- Fast cure time for inline processes supports higher productivity.
- Excellent moldability can improve yield during molding processes.