Our power module epoxy molding compounds achieve good reliability in terms of low CTE, low modulus and high Tg, and are able to reduce stress caused by temperature fluctuations.
In addition, they are ideally suited to organic substrate packages.
- Large Packages >>> High Flowability / Good Fillability in Narrow Spaces
- Asymmetrical Packages >>> Low Warpage (Low Shrinkage / High Tg)
- High Thermo Stability >>> High Tg, High Purity
- TCT (Thermal Cycle Test) >>> Low CTE, Low Modulus, High Tg
- Long-term Reliability >>> High Tracking Resistance