Our high thermal conductivity epoxy molding compounds are low stress with excellent moldability and reliability.
The rapid curing characteristics of this grade are suitable for auto mold machines.
Our high thermal conductivity epoxy molding compounds can mold with zero void for packages with different gap clearances on the top and bottom of the frame.
Evaluated Package: TO-220
Bottom Gap Clearance: 0.3mm
Isolated packages (TO-220, TO-3P, etc.) that require high thermal dispersion.
Large power module packages that require very high heat dispersion.