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Semiconductor Industry: KYOCERA and Vicor to Collaborate on Advanced Power-on-Package Solutions
Collaboration will maximize AI performance and minimize time-to-market for new processor designs
April 10, 2019Japan
Vicor's Power-on-Package technology enables current multiplication within the processor package, allowing for higher efficiency, density, and bandwidth. Providing current multiplication within the package can reduce interconnect losses by up to 90 percent, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality. Vicor's Power-on-Package solutions were featured at the NVIDIA GPU Technology Conference 2018 and China ODCC 2018 Summit. Vicor's advanced Power-on-Package technology enables Vertical Power Delivery (VPD) from the bottom side of the processor. VPD virtually eliminates Power Delivery Network (PDN) losses while maximizing I/O capability and design flexibility.
Kyocera's proprietary solutions to optimize processor performance and reliability are based on decades of experience in package, module and motherboard manufacturing for customers worldwide. Kyocera has cultivated design expertise by applying Vicor's Power-on-Package devices in multiple applications. By utilizing its design technology, simulation tools and manufacturing experience, Kyocera provides optimal designs for complex I/O routing, high speed memory routing, and high-current power delivery. Through collaboration, Kyocera and Vicor will bring new solutions for AI and high-performance processor applications to market.
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