News Releases

Kyocera Corporation’s (headquarters: Kyoto City; president: Tetsuo Kuba) wholly-owned subsidiary dedicated to production of high-density wiring boards for servers and network equipment, Kyocera SLC Technologies Corporation (headquarters: Yasu City, Shiga Pref.; president: Kazuyuki Nada; herein “KST”), today announced that it will establish a second manufacturing facility at its Kyoto Ayabe Plant (Ayabe City, Kyoto Pref.) in order to further expand its business.

With the widespread implementation of LTE networks, there is an increasing demand for smaller, lower profile FC-CSP^*1 substrates for use in highly functional smartphones and tablet PCs. In the new Kyoto Ayabe Plant facility, KST will manufacture FC-CSP substrates for which the compound annual growth rate is expected to exceed 30%. By constructing a second facility at the Kyoto Ayabe Plant, KST plans to expand its FC-CSP substrate business.

KST holds the top market share for FC-BGA substrates applied in high-end ASICs^*2, and over the years has cultivated technologies such as high-density wiring, automation of production processes, and manufacturing technology for smaller, lower profile products. Utilizing these technologies, KST will increase capacity and enhance efficiency for production of FC-CSP substrates and respond to the strong market demand. By strengthening production of FC-CSP substrates in addition to FC-BGA substrates and expanding its business area, KST aims to become a comprehensive manufacturer of printed wiring boards including high-density wiring boards.

With increased production in the second facility at the Kyoto Ayabe Plant, the Kyocera Group hopes to contribute to economic development and create employment opportunities in the Kyoto area.

Outline of the Second Facility

Name	KYOCERA SLC Technologies Corporation Kyoto Ayabe Plant, Second Facility
Location	Ayabe City, Kyoto Pref. (Japan)
Facility size	Building area: approx. 12,230m2　 (steel-framed, two floors, 140×84m) Floor space: approx. 24,260 m2
Construction plan	Groundbreaking: May 2013 (planned) Completion: December 2013 (planned)
Start of operations	Summer of 2014 (planned)
Operations	Manufacture of FC-CSP (flip-chip chip scale packaging) substrates
Production	Target an annual production of 20 billion yen within several years.

Note: The factory building will be designed with environmental consideration in order to realize energy conservation, for example, by reducing use of electricity and water.

*1 FC-CSP (flip-chip chip scale packaging) substrates are organic packaging substrates applied as core components in application processors or baseband processors for smartphones and tablet PCs.
*2 FC-BGA substrates for high-end ASICs are organic substrates for specific applications, such as host servers and network equipment in banks or brokerage houses for which high speed data processing and high reliability are required.