News Releases

This news release is intended for media purposes, and is current of the date of publication. Information is subject to change without notice.

KYOCERA Breaks Ground on New Manufacturing Plant for Ceramic Microelectronic Packages in Kagoshima, Japan

New facility to increase capacity by 25%, support IoT growth with ceramic packages for electronic and semiconductor components including SMD and CMOS devices

June 20, 2018
Kyocera Corporation (President: Hideo Tanimoto) held a groundbreaking ceremony on June 20, 2018 for a new plant at its Kagoshima Sendai manufacturing complex in Japan. The company aims to increase production of ceramic microelectronic packages to accommodate robust demand and to expand related businesses in the future.

Image: Groundbreaking Ceremony
Groundbreaking Ceremony

The new facility, which Kyocera plans to open in August 2019, will bring a 25 percent increase in the company's total production capacity for ceramic packages used to house SMD*1 electronic devices and CMOS*2 image sensors, and will allow the company to expand production for other items depending on future needs. Kyocera entered into a site location agreement with the governor of Kagoshima Prefecture and the mayor of Satsumasendai earlier this year.

The electronics industry is now experiencing new growth fueled by big data, artificial intelligence, and the Internet of Things (IoT). The development of advanced driver-assist systems (ADAS) and technology that supports minimally invasive medical treatments will drive future growth as well. The new Sendai facility will significantly increase Kyocera's production capacity for two key enablers of these applications — SMD ceramic packages and packages to house CMOS image sensors — as well as ceramic packages for automotive and medical devices.

Details of the New Plant
Name Kyocera Corporation Kagoshima Sendai Plant (the 22nd facility on the premises)
Location Kyocera's Kagoshima Sendai Manufacturing Campus,
1810 Taki-cho Satsumasendai, Kagoshima 895-0292 Japan
Total investment Approximately 5.9 billion yen (approx. USD 53.6 million)
Building area 8,235m2 steel construction with 6 stories
Total floor space 42,283m2
Construction plan Begin construction: June 2018; start manufacturing: August 2019
Main products SMD ceramic packages, ceramic packages for CMOS image sensors
First-year production plan Approximately 3.8 billion yen (from August 2019 through March 2020)
*1 SMD: Surface-mount device
*2 CMOS: Complementary metal oxide semiconductor