Kyocera offers thermal printheads with high productivity and reliability by using its unique face-down IC bonding method instead of the conventional wire bonding method. By leveraging the advanced thin film technology production lines all the way through from ceramic substrates to finished products Kyocera flexibly addresses all demands for custom-designed thermal printheads by optimized selection of features such as glaze shape, resistance and overcoat. |
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In addition, Kyocera delivers a wide variety of printhead structures, such as line type, true edge type and corner edge type, from low to high resolution, which cover the industry's broad applications. |
Japan
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