| Kyocera’s core printing and print-component technologies are inspiring new applications. We have applied our micro-fabrication expertise and micro-device technologies to support diverse product development functions, including UV light modules for UV ink curing and integrated sensor devices. |
| Assembly, Design and Inspection Technologies |
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UV Light Module for UV Ink Curing
- Cost-effective design makes it suitable for diverse applications
- Unique design with flexible exposure width (2-inch) achieves high luminous efficiency |
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| Applications and Features |
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UV Ink Curing for Offset Printing
Center Emission Wavelength: 375-395nm |
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UV Ink Curing for Inkjet Printing
Illuminance: 400mW/cm2 or higher |
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Curing of Various UV Adhesives
Dimming Function: 20-100% |
| Deposition / Photolithography Technology |
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Micro Matrix LEDs
Kyocera uses its high-density design capabilities to develop ultra-compact, high-definition, dot-matrix LEDs (1,024 dots per chip) |
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| Minimum Pitch: 120μm and Higher |
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Max. Brightness: Approx. 10,000cd |
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Enlarged Display with Additional Optical System |
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Integrated Sensor Device （LEDs & PDs）
LEDs and photo diodes (PDs) aligned in array formation can detect color, optical density and position precisely |
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| Applications and Features |
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| Form Photodiode and LED on Si |
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Array Pitch: 400μm and Lower |
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LED Wavelength: 850nm
Dot Pitch: 120μm and Higher |
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Japan
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