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Power Module Packages |
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| Kyocera provides power module packages using layer stack-up of silicon nitride ceramic substrate and copper plates. The copper plates are bonded to the silicon nitride by using high-reliability active metal bonding method. This is used as a hermetic power module package in the industry. |
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( Figure 1 )
0.9 or 1.8mm Diameter High Current Carrying Copper Filled Via
Cross Section |
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| Hermetic Power Module Package |
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 Features |
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- High Reliability: Hermeticity confirmed after 1000 cycles of TCT (-65oC to +150oC) - a reference Kyocera test result
- 0.15 to 0.3mm-thick Copper (Volume Resistivity: 1.7μ
 ·cm, Thermal Conductivity: 394W/mK)
- Multilayer Structure: Copper plates and silicon nitride ceramic substrate are bonded by active metal bonding method.
- Upper layer circuits and lower layer circuits are connected by copper filled via holes. ( Figure 1 )
- Reduced Size, Thickness and Weight.
- Screw Clamping
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| An Example to Replace Conventional Technology |
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