Kyocera provides power electronics packages by using ceramic-to-metal bonding technologies.
 Standard Products List (pdf/44KB) 
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Copper-Bonded Silicon Nitride Packages |
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Silicon nitride ceramic substrate: High strength (flexural strength: 850MPa) |
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Copper plates and silicon nitride ceramic substrates are bonded by active metal bonding method. Upper layer circuits are connected to lower ones by buried copper vias. |
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High reliability: Hermeticity confirmed after 1000 cycles (-65oC to +150oC) of temperature cycling test (sample: five pieces; Kyocera test results) |
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Copper-Bonded Silicon Nitride Substrates |
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Silicon nitride ceramic substrate: High strength (flexural strength: 850MPa) |
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Copper plates and silicon nitride ceramic substrates are bonded by active metal bonding method |
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High reliability: Insulation resistance and dielectric withstand voltage confirmed after 5000 cycles (-60oC to +175oC) of temperature cycling test (sample: five pieces; Kyocera test results) |
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TO-254 / TO-257 Ceramic Packages |
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Copper-core pins and metal heat sinks are bonded onto multilayer alumina ceramic packages |
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High reliability: Hermeticity and dielectric withstand voltage confirmed after 1000 cycles (-65oC to +175oC) of temperature cycling test (sample: ten pieces; Kyocera test results) |
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| Related Products |
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