Ceramic Packages for Power Electronics

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Kyocera provides power electronics packages by using ceramic-to-metal bonding technologies.

Standard Products List (pdf/44KB) PDF

 Copper-Bonded Silicon Nitride Packages
Copper-Bonded Silicon Nitride Packages
· Silicon nitride ceramic substrate: High strength (flexural strength: 850MPa)
· Copper plates and silicon nitride ceramic substrates are bonded by active metal bonding method. Upper layer circuits are connected to lower ones by buried copper vias.
· High reliability: Hermeticity confirmed after 1000 cycles (-65oC to +150oC) of temperature cycling test (sample: five pieces; Kyocera test results)
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 Copper-Bonded Silicon Nitride Substrates
Copper-Bonded Silicon Nitride Substrates
· Silicon nitride ceramic substrate: High strength (flexural strength: 850MPa)
· Copper plates and silicon nitride ceramic substrates are bonded by active metal bonding method
· High reliability: Insulation resistance and dielectric withstand voltage confirmed after 5000 cycles (-60oC to +175oC) of temperature cycling test (sample: five pieces; Kyocera test results)


 TO-254 / TO-257 Ceramic Packages
TO-254 / TO-257 Ceramic Packages
· Copper-core pins and metal heat sinks are bonded onto multilayer alumina ceramic packages
· High reliability: Hermeticity and dielectric withstand voltage confirmed after 1000 cycles (-65oC to +175oC) of temperature cycling test (sample: ten pieces; Kyocera test results)

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