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Organic Packages / Printed Wiring Boards

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Embedded-Component PWBs

Provides smaller size, light weight and compactness

In response to demands for size/weight reduction and increased speed and function of assembled products such as mobile devices and functional modules, our component-embedded boards allow for a reduction of mounting space and the enhancement of electric properties.

Features

  • High reliability achieved by laser via connection.
  • High density wiring achieved by AnyLayer connection.
  • Thinner/higher density design enables base plate, T/H via to be removed.
  • Reliability of secondary mounting enhanced by connection of embedded components with via.

Specifications

(1) Passive embedded element

ItemSpecificationNote
Layer count 6-10 Layers
Total board thickness 0.43mm (8 Layers) 0.34mm (6 Layers), 0.53mm (10 Layers)
Conductor thickness 20-25μm
Line/space (Min.) 75/75μm
Via diameter (hole/land) 75/175μm (Outer Layer) 100/250μm (Inner Layer)
Inner Via Hole drill/Land (Min.) φ200/φ350μm
CR implementation specifications 0.22-0.33mm Part height
400μm Via pace for part connection

(2) Active embedded element

ItemSpecificationNote
Layer count 7 Layers
Total board thickness 0.73mm
Line/space (Min.) 75/75μm
Via diameter (hole/land) 75/175μm (Outer Layer) 100/250μm (Inner Layer)
Inner Via Hole drill/Land (Min.) φ200/φ350μm
WLP implementation specifications 0.3mm Part height
6.50mm Size
0.25mm Post diameter
0.50mm Post pitch

Structure

(1) Passive embedded element

(1) Passive embedded element

(2) Active embedded element

(2) Active embedded element

Applications

  • Various module products
  • Mobile phones
  • PDA devices

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