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Organic Packages / Printed Wiring Boards

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Printed Wiring Boards

AnyLayer PWBs
Line and space are 40μm/40μm, which is one of the most advanced technologies in the market. AnyLayer PWBs will reduce thickness of HDI PWBs and miniaturize HDI PWBs. High reliability has been proven after various stringent tests imposed on mobile devices.
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Organic Package
Build-up Structure FC-BGA
FC-CSP Substrates
Module Substates
Thin Type Module Substrates
Printed Wiring Boards
AnyLayer PWBs
Board Design
Simulation
Transmission Line Simulation
Power Supply Noise Simulation
EMI / ESD / Thermal Simulation
One-stop Solution
Development Flow Chart
List of Technologies We Can Handle
Case Example
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