| Ultrasonic
Motor Direct Drive |
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XY Stage with high accuracy is definitely required
for EB Lithography in the semiconductor manufacturing process. Other applications
are wafer inspection, ion beam defect correction and scanning electron microscopes.
The high accuracy of Kyocera's XY Stage is achieved by using a high purity, rigid,
alumina material with a low thermal expansion coefficient in combination with
an ultrasonic linear motor for the drive system.
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Ceramics Components for Semiconductor Processing
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| Wafer
Polishing Plate |
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High purity alumina wafer polishing plates provide
excellent flatness control over a long period of time. The ceramic material advantages
include excellent wear resistance, high rigidity and superior flatness retention
compared to metal. The ceramic plates are available with a flatness spec of less
than 1 micron and sizes from 12" to 40".
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Ceramics Components for Semiconductor Processing
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| SiC
Polishing Plate |
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Silicon Carbide polishing plates for single wafer
processing feature the advantages of high thermal conductivity, low thermal expansion,
high rigidity, excellent thermal uniformity, superior wear resistance, high corrosion
resistance and better flatness retention compared to metal. The plates are available
with a concave, flat or convex surface up to 12" diameter in size.
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Ceramics Components for Semiconductor Processing
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| Plasma
Proof Series (Anti-Plasma materials) |
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In the next generation of plasma etching technology,
there are some problems such as erosion, particle contamination and the dissociation
of oxygen. Kyocera offers anti-plasma materials which are suitable for the next
generation of etching technology.
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Ceramics Components for Semiconductor Processing
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| LCD
Manufacturing Equipment Parts |
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As the size of Liquid Crystal Displays becomes larger
and the manufacturing precision becomes even more critical, larger and higher
accuracy manufacturing equipments will be required. Kyocera produces large-size
ceramic parts made of various high strength and high purity advanced ceramic materials.
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Ceramics Components for Semiconductor Processing
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| Vacuum
Chuck |
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Kyocera's Ceramic Vacuum Chucks are manufactured
with high accuracy and complex surface shapes. Vacuum chucks are used for holding
wafers during various semiconductor processes.
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Ceramics Components for Semiconductor Processing
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| Electro-Static
Chuck |
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Kyocera's Electro-Static Chucks are used in a wide
range of low and high temperature semiconductor processes. They feature excellent
thermal conductivity and uniformity, high chucking force regardless of thickness,
high dielectric constant and superior wear resistance. The chucks are available
in aluminum nitride, alumina and sapphire.
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Ceramics Components for Semiconductor Processing
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| High
purity AlN ceramic heater |
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Kyocera's Aluminum Nitride Heater, used in semiconductor
processing, features excellent thermal uniformity, rapid heat up, easy temperature
control, excellent plasma durability and less contamination. The purity of the
material used to manufacture the heater is greater than 99.9%.
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Ceramics Components for Semiconductor Processing
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| Handling Arm |
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Kyocera produces handing arms with high temperature resistance. If there is requirement to reduce damage against mating parts, to reduce particles, Kyocera can Apply coating such as DLC(Diamond Like Carbon)on ceramics surface.
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Ceramics Components for Semiconductor Processing
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| Single
Crystal Sapphire |
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The demand for single crystal sapphire has been
expanding rapidly due to its superior electrical and mechanical properties, chemical
stability and light transmission. Kyocera mass produces single crystal sapphire
using the " EFG " growing method which provides the advantages of crystal
orientation control, and the flexibility of configuration in cross section.
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Single
Crystal Sapphire
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| Metallized Products |
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Kyocera's Metallized Products are used in various
applications such as semiconductor processing equipment, vacuum switches, surge
arrestors, magnetron parts, medical components and analytical equipment. Kyocera
can braze various metals to a host of advanced ceramic materials. Flanges can
then be welded on for attachment of the ceramic assembly to equipment.
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