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Products > Fine Ceramics > Products Japan
Electronics Industries  
 Tape Substrates for Thick Film
We are producing 96% alumina substrates (A-476) and 93% alumina substrates (A-473T) which have excellent thick film reliability and consistency.

Features
Our substrates have excellent thick film reliability and precise dimensional tolerance control (Super premium: ±0.25%). They are cost effective for through-hole processes with small diameter holes (Min. 0.2mm) allowing densification of precision circuitry.

Tape Substrates for Thick Film
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Pressed and extruded parts
Parts with Kyocera's advanced press forming and extrusion forming technologies are being used as Insulators for electric equipments. Kyocera can offer excellent characteristics such as mechanical strength, heat resistance, wear resistance, chemical resistance and so on, by selecting best suitable material among variety of available materials.


Pressed and extruded parts
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Thin Film Substrates
For thin film deposition, we have 99.6% alumina substrates (A-493,A-494) which offer excellent surface smoothness.

Thin Film Substrates
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Polished Substrates For Thin Film
Features
Excellent surface quality for thin film application.
Tight dimensional tolerances (thickness, flatness).

Material
Kyocera A493, A494 (99.6% alumina)
Available thickness .010"-.0315"
(0.25-0.80mm)
 
* .002" thickness is available with maximum size of 2" × 2" and 8 µ inch surface finish.

Visual Defects
Scratches: .0003" deep max.
Voids: .0008"dia max.
Contamination: Not allowed (by naked eye)

Polished Substrates For Thin Film
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Glazed Substrates for Thermal Printheads
Features
Kyocera glazed substrates consist of 96% alumina with a glass overcoat. They have superior flatness and fewer surface defects so it is very applicable for thermal printheads used in advanced and downsized facsimile machines. Kyocera can provide various types of glazed substrates for each application such as partial glazed, full glazed and serial glazed substrates.

Glazed Substrates for Thermal Printheads
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Microwave Dielectric Ceramics
1.Filter, Isolator, MIC
Features
Miniaturization of circuit size is possible due to the ceramic's high dielectric constant.
High Q values even at high frequencies.
Stable circuit operation can be obtained due to the low temperature coefficient of the dielectric constant.
Because of a wide range of dielectric values, circuit design can be tailored to fit the application more easily.
Surface finish can be selected to allow use with thin film or thick film technologies.
Numerous custom designs such as holes, complicated 3 dimensional shapes, and snaplines are available due to Kyocera's advanced dry press technology.

2. Dielectric Resonator (DR) (Satellite Broadcast,Base Station)
Features
Downsizing of DR or cavity is possible because of high er and high Q value.
Stable electrical characteristics

Microwave Dielectric Ceramics
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Aluminum Nitride Substrates
Features
High thermal conductivity (7 to 8 times as much as Al2O3)
Thermal expansion is close to Silicon wafer.
High mechanical strength and high density.
High chemical durability.

Aluminum Nitride Substrates
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Ferrite
Features
Kyocera's various material line-up corresponding to wide range of characteristics and frequencies.
Cores and cases with high dimensional precision by superior forming technology.
Ferrite and alumina cases appropriate for closed magnetic circuits and SMT.
Very small cores and cases suitable for downsize and low height.
Electrode metallization available.

Ferrite
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 Sapphire Substrate
The demand for single crystal sapphire has been expanding rapidly due to its superior electrical and mechanical properties, chemical stability and light transmission. Kyocera mass produces single crystal sapphire using the " EFG " growing method which provides the advantages of crystal orientation control, and the flexibility of configuration in cross section.

Sapphire Substrate
Electronic Fine Ceramics
(pdf/13,159KB) PDF
 
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Material Characteristics Chart
(pdf/237KB)

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