SiC (Silicon Carbide) Polishing Plates
Less deformation through lower thermal distribution. Stronger chemical resistance. A range of surface profiles are available.Polishing plate features minimal deformation due to high thermal conductivity, low thermal expansion coefficient, high stiffness and excellent thermal uniformity. It also features excellent chemical resistance and various surface profile options including concave, flat or convex.
Property
High Young's Modulus
Low Thermal Expansion
High Thermal Conductivity
Chemical Resistance
Thermal Uniformity
Product specs
- Material
- Silicon Carbide
- Shape
- Convex, flat and concave available.
- Size
- MAXφ30"
- Precision
- Flatness: 1μm or less
Applications
- Wafer Polishing