Heat Dissipation Structure Ceramic Substrates

Feedthroughs (Multi-pin)

Multi-pin terminal feedthroughs are based on advanced ceramic-to-metal bonding technology.

Kyocera offers a wide variety of feedthrough connectors, based on our ceramic-to-metal bonding technology and many years of experience in the ultra-high vacuum fields including radiation light source and aerospace. These open tool products meet the specifications of standard coaxial connectors and multi-pin connectors. They are used in a wide range of applications from cutting-edge technology and science, such as radiation light source and nuclear fusion, to industrial equipment such as semiconductor processing equipment.


Hermeticity Bonding Technology

Product specs

Metallized Components
Air tightness
1.3×10-10 Pa/m3/s or less
Anti heat temperature
300℃ or less (baking temperature)


  • Feedthroughs for Scientific Equipment, Semiconductor Processing Equipment, Industrial Manufacturing Equipment

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