Heat Dissipation Structure Ceramic Substrates

Heat Dissipation Structure Ceramic Substrates

Monolithic ceramic structure with no bonding material for long-term reliability.

- Cooling or heat exchanging components made of light
  weight ceramic with low heat capacity provide a more
  efficient, energy saving system compared to metal.
- Design possibility for thin wall or complex structure.
- Long term, efficient cooling and temperature control.
- Low maintenance cost due to superior chemical durability.
- Applicational exploitation other than cooling or
  temperature control.


Design flexibility High-Temperature Durability Chemical Resistance Bonding Technology High Efficiency Heat Exchange

Product specs

Alumina, Silicon Carbide



  • Heat Element Cooler
  • Thermal Control Component
  • Heat exchanger components
  • Manifolds

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