Substrates for Power Modules
High-strength substrates compatible with the direct bonding of copper sheets are suitable for a wide range of power module applications.Kyocera manufactures high-strength substrate materials for power module applications. Available materials are Alumina (A476T, A477A) and Zirconia-toughened Alumina (AZ211), depending on your requirements for performance and cost.
Property
High Strength
Low Thermal Expansion
Insulation Property
Product specs
- Material
- Alumina / Alumina-Zirconia
- Shape
- Substrate
Features
Size & Characteristics
*Values are typical data from test pieces.
Applications
Power Module Parts