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Power Devices

Package List 1
QFPQFNSOPDIPSIP
ZIP*
DiscreteModule
LargeSmallThin
Large
ThickSmallThin
Large
SmallPowerSMDPhoto-
Coup.
PowerGeneral
KE-200
KE-300
KE-320
KE-500
KE-850
High Thermal
Conductivity
KE-1000
KE-G300

☆: ideal application ○: available application
*ZIP = Zigzag Inline Package
All grades are Br/Sb free

Package List 2
P-BGAF-BGAModule
singlemapFlip ChipmapFlip Chippowergeneral
KE-G1250AH
Compression Molding
KE-G1250DS
KE-G1270

☆: ideal application ○: available application
*MAP = Mold Array Package
All grades are Br/Sb free

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