close

Organic Materials

Japanese site

Epoxy MoldingCompounds (Standard Grade)

表面実装用エポキシ封止材

We offer EMCs with high reliability and good workability for various semiconductor packages.

  • We offer common type EMCs that can achieve high reliability in diodes and transistors, in sizes through LSI
  • Due to its good curability, it can be used in various molding machines ranging from conventional type to auto-mold type
  • Can encapsulate large-size die due to its lower modulus
    Good workability can contribute to improved productivity
CharacteristicUnitKE-300TS-1KE-300AHKE-320HKE-1000SV
Spiral Flow cm 90 90 65 95
Gelation Time s 30 22 23 28
Specific Gravity - 1.8 1.9 1.9 1.8
CTE α1 ppm/K 18 15 12 15
α2 65 55 48 58
Tg °C 165 155 155 200
Flexural Strength MPa 140 150 165 135
Flexural Modulus GPa 12.5 13.5 17.0 12.5

Back to TOP