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KE-G5000 / KE-G3000 Series High Adhesive EMCs

表面実装用封止材

Excellent reflow performance through high adhesive strength

Features

  • Excellent reflow performance through high adhesive strength
  • Excellent high temperature storage performance
  • We have a variety of EMCs which are suitable for various frames, such as Copper, 42Alloy and Pd/Au plated

Applications

  • Automotive
  • Electronics
  • Applicable Packages:
    TSOP, SOP, QFP, QFN, DIP, TO, High-Voltage Diode
GradeKE-G5000KE-G3000DKE-G3000N-AS
Feature Standard Standard For QFN
Spiral Flow (cm) 90 105 190
Gelation Time (s) 30 20 40
Flow Viscosity (Pa•s) 12 10 5
Tg (°C) 115 120 125
CTE α1 (ppm/K) 10 10 10
CTE α2 (ppm/K) 35 38 40
Flexural Modulus @RT (GPa) 25 23 23
Impurity Cl- (ppm) 8 8 8
Thermal Conductivity (W/mK) 0.9 0.9 0.9

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