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Sheet EMC, KE-G1250SS series

We have developed sheet EMCs to improve the quality
and productivity of semiconductor encapsulation for large-size and/or
low-profile packages.

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Features

柔軟性

  • Improves productivity fo large-size and low-profile molding
  • Same reliable performance as conventional EMCs
  • Flexible sheets are durable and easy to handle
  • Available sheet size : 500mm x 450mm max., 0.1mm to 1.5mm thick

Main Characteristics

ItemUnitKE-G1250 SS-A
(top cut: 55µm)
KE-G1250 SS-FC20
(top cut: 20µm)
Spiral Flow 175°C [cm] 200 >250
Gelation Time 175°C [s] 60 60
Flow Viscosity 175°C [Pa・s] 7 5
Specific
Gravity
25°C [g/cm3] 2.01 1.98
Tg (by TMA) [°C] 110 110
CTE α1 [ppm/K] 9 12
α2 [ppm/K] 35 40
Flexural
Strength
25°C [MPa] 175 170
Flexural
Modulus
25°C [GPa] 25 25

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