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Compression Mold EMCs

Our materials have excellent properties of fill ability, warpage control and adhesion, especially for thin packages with highly stacked dies and long loops of thin wires.

Features

KE-G1250 シリーズ 圧縮成形用封止材

  • Good moldability even with higher filler content (~91wt%)
  • No wire sweep (Au; Φ15 x 6mm)
  • No cull, no runner
  • Can reduce warpage even for thick packages (e.g. PBGA)
  • Applicable for thin wires (applicable for Cu wire)
  • High adhesive strength and high reliability by minimizing the usage of wax

We have several grades of compression mold EMCs which are now in mass production.
Warpage is controlled by the optimization of mold shrinkage, Tg, CTE, and modulus.

Characteristic KE-G1250
AH-J
KE-G1250
AH-W3E
KE-G1250
AH-GL
Application Package PBGA FBGA LGA FBGA
Wire Type Auφ15
4.5mmMax
Auφ18
2.5mmMax
Cuφ16.5
3.6mmMax
Spiral Flow (cm) 160 160 190
Gelation Time (s) 85 55 95
Flow Viscosity (Pa・s) 7 15 9
Specific Gravity (-) 2.03 1.99 1.99
Tg (°C) 135 150 145
CTE α1 (ppm/K) 7 9 10
CTE α2 (ppm/K) 27 37 37
Flexural Modulus
25°C (GPa)
29 25 23
Mold Shrinkage (%) 0.11 0.14 0.25
EC (mS/m) 3 3 3
pH (-) 4.5 4.5 5.5
Na+ (ppm) 2 2 2
Cl- (ppm) 15 25 12

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